Ultra-Low Latency Edge Analytics and Cyber-Physical Digital Twins for Closed-Loop Quality Assurance in High-Speed Semiconductor Packaging. The Science Post, [S. l.], v. 2, n. 3, 2026. Disponível em: https://www.thesciencepostjournal.com/index.php/tsp/article/view/343. Acesso em: 29 sep. 2026.